Abstract

Interface morphology evolution of Sn-3Ag-0.5Cu solder and Sn-3Ag-0.5Cu +ZnO solder during isothermal aging at 170°C for different times was investigated to explore the influence of micrometer ZnO particles. Scanning electron microscopy was used to analyze the microstructure evolution of the solder joints and to measure the thickness of IMCs layer. Results demonstrate that addition of ZnO particles into Sn-3Ag-0.5Cu solder because IMCs layer a layer type and flatter other than a transition form from scallop type to nearly layer type with increasing aging time. Meanwhile, the microstructures of Sn-3Ag-0.5Cu +ZnO solder are finer than those of without ZnO particles. It is noteworthy that there is little Kirkendall voids existed in IMCs layer of Sn-3Ag-0.5Cu +ZnO solder. In addition, the kinetic growth equation of two soldiers are observed, and the growth coefficient k is 0.5361 and 0.8264 for Sn-3Ag-0.5Cu solder joints with and without micrometer ZnO particles respectively, it can illustrate that the growth coefficient is reduced by 35% as adding micrometer ZnO particles. The reason is that the addition of ZnO particles which disperse uniformly in solder can refrain the growth of IMCs layer. Hence, it is observed that the micrometer ZnO particles can significantly promote the reliability of Sn-3Ag-0.5Cu solder joints.

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