Influence of vibration and environmental factors on a crimped assembly resistivity

Abstract

The paper focus on showing using statistical analysis the relevance of vibration, temperature, and humidity on a crimped connection between a copper wire and copper terminal. As a primary metric it was used, as baseline, the behavior of the resistivity of a crimped assembly after vibration, humidity, and temperature tests in order to analyze and conclude if there is a significant relation between all these environmental factors and the crimped height. The core activity of this experiment consists in the analysis performed on 50 crimped assemblies where the main dimensional characteristics were achieved using a specific crimping normative, followed by a sequence of environmental testing steps, in order to obtain a significant number of data points that enable us to create a proper statistical model to analyze and conclude the influence of vibration (one of the main environmental factors tracked) over the crimped assembly.