Influence of vacuum annealing on the dispersion of thin double niobium-copper films deposited onto oxide materials

I I Gab,D B Shakhnin,T V Stetsyuk

doi:10.15330/pcss.21.2.332-337

Abstract

The kinetics of dispersion of thin niobium-copper films deposited onto leucosapphire, alumina and zirconia ceramics and annealed in vacuum at temperatures up to 1100 °C with different exposition times at each temperature (from 5 up to 20 min) was studied. The double films consisted of two layers: the first metallization layer was 150 nm niobium nanofilm deposited onto the oxide surface, and the second copper layer 1,5 mm thick deposited over the first one as a solder was used for joining of metallized oxide samples. It was found that these films remain rather dense during heating up to 1050 °C; and after annealing at 1100 °C they decompose into individual fragments covering about 80% the area of the ceramic substrates even after annealing during 20 min. The kinetic curves for the dispersion of these films were plotted.

Highlights

Joining ceramic materials with each other and with metals is carried out by two main methods: 1) brazing with molten metallic solders [1,2,3]; 2) solid-phase pressure welding [4,5,6]
Oxide ones, are usually poorly wetted by molten metals, metal coatings are often used applied in various ways
Solid non-metallic substrates were made of leucosapphire, alumina and zirconia ceramics as small thin plates 4 x 3 x 2 mm in size

Summary

Vasyl Stefanyk Precarpathian National University

The kinetics of dispersion of thin niobium-copper films deposited onto leucosapphire, alumina and zirconia ceramics and annealed in vacuum at temperatures up to 1100 C with different exposition times at each temperature (from 5 up to 20 min) was studied. The double films consisted of two layers: the first metallization layer was 150 nm niobium nanofilm deposited onto the oxide surface, and the second copper layer 1.5 m thick deposited over the first one as a solder was used for joining of metallized oxide samples. It was found that these films remain rather dense during heating up to 1050 °C; and after annealing at 1100 °C they decompose into individual fragments covering about 80% the area of the ceramic substrates even after annealing during 20 min. The kinetic curves for the dispersion of these films were plotted.

Introduction

Results and Discussion

Conclusions