Abstract
Quartz glass is of great technical importance and getting more attractive as a possible candidate for microelectronic packaging substrate or window. In this work, the significant role of active element titanium (Ti) for soldering quartz glass substrates by Bi42Sn2Ag2Ti(Ce,Ga) alloy filler at 170 °C in atmospheric conditions was studied. The time of soldering process was set to be 1, 15, 30, and 60 min, respectively. The microstructures and the dynamic evolution of active element Ti influenced by soldering time were investigated. The glass/solder interface was observed by scanning electron microscopy and the distribution of each element was analyzed by energy dispersive X-ray spectrometry. Results show that the bonding could be achieved by adsorption and segregation of Ti at the interface between quartz glass and active solder. The adsorption and segregation of the Ti element at the quartz glass/solder interface was analyzed theoretically, and the interfacial reaction has been investigated. The understanding of diffusion kinetics of Ti element can further explain the mechanism of active soldering.
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