Influence of TiH2 on Interfacial Reaction Features Between Cubic Boron Nitride and Cu-Sn-Ti Active Filler Metals

Abstract

Cubic boron nitride (CBN) grains are brazed by Cu-Sn-Ti filler metal in vacuum at 1223 K. Wetting behaviors, reaction layer features, and elemental distribution characteristics have been systematically investigated through scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD). The results show that when the TiH2 content is 5 wt pct, virtually no sharp-edged, partially coated, and uncoated CBN grains can be observed, indicating that adequate wetting could be achieved. Moreover, a continuous reaction layer with uniform thickness (1.30 μm) consisting of TiN, TiB2, and TiB is obtained, which indicates that large numbers of TiN, TiB2, and TiB compounds could have been formed at the interface. However, when the TiH2 content exceeds 5 wt pct, the thickness of the reaction layer is no longer significantly expanding and excessive Ti present in the matrix will lower the volume percentage of Cu3Sn1 phase, which will reduce the bonding strength of the brazing samples. Wear tests indicate that the minimum weight loss also occurs at 5 wt pct TiH2.