Abstract
A high-temperature guarded hot plate (GHP) apparatus was developed by the Shandong Nonmetallic Materials Institute for the thermal conductivity of insulations. To investigate the influence of the thermal contact resistance of this apparatus under high-temperature test condition on the measurement results, the mullite specimen was measured under different pressures and temperatures before and after the surface treatment. The result indicated that the influence of thermal contact resistance on measurement results was remarkable only under the low-pressure, low-temperature condition with the surface untreated, and could be ignored under routine testing condition. To further confirm this conclusion, the specimen was ground to different thicknesses and then measured with a pressure 2.0 kPa at different temperatures. The measurement results showed that the thermal contact resistance of this high-temperature GHP apparatus was assumed to be sufficiently small at this pressure, especially at higher temperature.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
