Abstract
Al-Si-Mg alloys are investigated to determine the relationship between changes in the thermal diffusivity and precipitation behavior of the Mg2Si phase with various contents of Mg2Si and aging treatment conditions. The samples were solid solution-treated and then quenched with water (80 °C). Aging treatments were implemented at temperatures ranging from 180 to 240 °C for 5 h. The precipitation behavior of Mg2Si was observed using a heat flow curve using differential scanning calorimetry analysis. The thermal diffusivity of Al-Mg2Si alloy was affected by the precipitation of the Mg2Si phase, particularly in the meta-stable β phase. In the temperature range of precipitation occurrence, the thermal diffusivity of the alloy increased with the temperature when the precipitation of the meta-stable β phase of the sample was incomplete. However, at the same temperature, the samples in which precipitation had completed did not have any increased thermal diffusivity. The thermal diffusivity of the samples decreased when the meta-stable Mg2Si phase had dissolved in the matrix. The precipitation and dissolution of Mg2Si mainly affected the variation of thermal diffusivity in Al-Si-Mg. In contrast, the stable Mg2Si phase was not affected by changes in thermal diffusivity at a high temperature.
Highlights
Since electric appliances have gradually become smaller and are packaged with additional features including complex specifications, the operating temperature has become an important issue.Heat in an electronic application reduces both the efficiency of the electronic device and its service life [1,2]
The aim of this paper is to study the effects of Mg2 Si content and phase precipitation on the thermal diffusivity of Al-Mg2 Si alloys
The thermal diffusivities of all of the alloys at the final temperature in zone 2 eventually became conclusions were drawn: the same regardless of the aging treatment because the precipitation reactions of each alloy were at that temperature
Summary
Heat in an electronic application reduces both the efficiency of the electronic device and its service life [1,2]. One of the cooling methods used for electronic applications is the heat sink attachment method. According to Fourier’s law, the heat dissipation efficiency of a heat sink is proportional to the thermal conductivity of the heat sink material [3]. When the heat sink has thermal conductivity κ, Fourier’s law is expressed as: dq/dt = −κA(dT/dx) (1). Where κ is the thermal conductivity, dq/dt is the heat flow, A is the cross sectional area in the x direction, and dT/dx is the temperature difference in the +x direction. Using materials with high thermal conductivity, such as heat sink materials, is commonly recommended [1]
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