Abstract
The influence of surface topography on adhesion hysteresis of thin film was studied. The Cu/Ti bilayer thin film was fabricated using dc magnetron sputtering technology and its surface adhesion force was measured using force-displacement curves of AFM. The experiment results show that the unload curve exhibits obvious adhesion hysteresis. The theoretical analysis on the influence of thin film roughness to the adhesion hysteresis was carried out using JKR model. The results show that the load curve and unload curve constitute a closed curve and that the smoother the surface, the more obvious adhesion hysteresis (that is, the rougher the surface, the less obvious adhesion hysteresis).
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