Abstract
The Ni-Fe thin films were produced via electrodeposition in four different modes - direct current, and three types of pulse-modes with different pulse duration onto Au sublayer. The correlation between technological parameters of the electrodeposition and microstructure was demonstrated. Analysis of microstructure evolution revealed an un-expected changing of the film growth mechanism from “island” to “layer-by-layer” with the decreasing of the grain size less than 10 nm. Explanation was found in binding energies competition, that has been defined using the unique AFM method, based on recording the angle of the cantilever twist, when scanning in contact with the surface.
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