Abstract
The problem of removing high heat fluxes from a powerful microelectronic element (chip, microprocessor) is one of the most difficult tasks. One of the promising methods for cooling is the use of two-phase systems in a minichannel with a stratified flow regime. Additive technologies allowing the creation of structured surfaces are of increasing interest. The study of heat transfer using structures on the surface in the form of cylindrical protrusions in comparison with a smooth surface with characteristic size (diameter and height) equal to 300 μm is presented in this work.
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