Abstract
Abstract The spin-coating method is a widely employed technique for thin film fabrication. However, edge effects can adversely affect the quality and utility of the films produced. This study investigates the influence of chamfered edges on the substrate during the spin-coating process on edge effects. Both experimental and simulation results indicate that smaller chamfer angles contribute to reducing the width of edge effects. Conversely, the width of the chamfer has a relatively minor impact on the extent of edge effects.
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