Influence of Substrate Characteristics on Single Ti Splat Bonding to Ceramic Substrates by Cold Spray

Abstract

The cold spray technique may be used to fabricate metal matrix composites and to metallize ceramics. Both applications involve the creation of metal/ceramic interfaces, which are well researched for other processes but not nearly as much for cold spray. Here, the effect of ceramic substrate composition and surface roughness on adhesion strength of metallic splats is investigated. Splat adhesion testing was performed on Ti splats deposited on Al2O3 substrates with varying average reduced peak height roughness (Rpk) values. Ti splats sprayed onto Al2O3 with the lowest surface roughness had a higher bond strength (305 ± 87 MPa) than splats deposited on the higher surface roughness Al2O3 (237 ± 47 MPa). Failed interfaces revealed that the bonding mechanism for substrates with higher surface roughness is predominantly mechanical interlocking. Adhesion to the Al2O3 substrate with low surface roughness is predominantly along the periphery of the particle where jetting occurs. Splat adhesion testing was also performed on Ti splats deposited on SiC. Ti splats had a significantly higher bond strength to all Al2O3 substrates than to SiC. Posttest observations of SiC substrates showed little evidence of bonding. Several rebounded or detached splats left traces of Ti along the periphery of the impacted particle.