Abstract
Epoxy based photopolymer–SU8 is evaluated as microwave packaging material for packaging of Radio Frequency Micro Electro Mechanical Systems (RFMEMS). Standard and Slotted Coplanar Wave guide (CPW) transmission lines are chosen as test vehicles. Transmission lines of lengths up to 10mm are formed on HRS substrates. The fabricated transmission lines are subjected to wafer level packaging. The measured S-parameter data shows a significant difference prior to and after packaging. Further, the effects due to the packaging could be model educing lumped components and the measured data are presented in this work.
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