Abstract
Thermal management difficulties in light emitting diodes (LEDs) incredibly impacts LEDs performance, reliability, and lifespan. To find a lasting solution to LEDs thermal management difficulties, MgO thin film was deposited on Cu substrate and used as heat spreader for LED package. Influence of structural and surface properties on thermal performance of LED was investigated by XRD, FESEM and AFM. Optimum LED thermal performance was recorded from the LED mounted to MgO heat spreader with low microstrain of 7.3 × 10–3, uniform particle size (34 nm), surface roughness (4.5 nm) and minimum peak-valley distance (1.90 nm). Thermal conductivity and thermal transient characterization illustrated that 0.6 M MgO thin film showed 15.73 W/mK, higher junction temperature difference (18.06 °C) with higher total thermal resistance difference (3.35 K/W). Improved illumination and reduction in LED surface temperature were recorded using MgO heat spreader from optical and thermal infrared analysis. Therefore, magnesium oxide thin film would be suggested as a heat spreader for enhancing LED’s thermal management.
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