Abstract
In this work we analyzed the mechanical damping behavior of amorphous Pd(77.5)Cu(6.0)Si(16.5) below the glass transition temperature (T(g)) with creep/recovery measurements. Here a correlation between temperature stimulation and external stress is found in an exponential, multiplicative way. This demonstrates that not only is the yield stress of the material influenced by temperature variation (mechanical melting) but also the secondary relaxation is modified under stress and temperature.
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Schedule a callMore From: The European Physical Journal B - Condensed Matter
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