Abstract
Organic contaminants adsorbed on the surface of silicon wafers do not always cause the degradation of gate-oxide integrity (GOI) degradation but very little information is available on the ambient atmosphere when wafers are loaded in an oxidation furnace. It has been found in this work that GOI is degraded when wafers having organic contamination are loaded in a nitrogen atmosphere, but that GOI degradation does not occur when the wafers are loaded in an oxygen-containing ambient. In a high-temperature nitrogen atmosphere, carbon remains in silicon dioxides, while in an oxygen-containing ambient, the organic contaminants will be oxidatively degraded and evaporated, so carbon does not remain on the surface.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
