Abstract
The paper presents some investigation results on the properties of forced cooling systems dedicated to electronic devices. Different structures of such systems, including Peltier modules, heat sinks, fans, and thermal interfaces, are considered. Compact thermal models of such systems are formulated. These models take into account a multipath heat transfer and make it possible to compute waveforms of the device’s internal temperature at selected values of the power dissipated in the device. The analytical formulas describing the dependences of the thermal resistance of electronic devices co-operating with the considered cooling systems on the power dissipated in the cooled electronic device and the power feeding the Peltier module and the speed of airflow caused by a fan are proposed. The correctness of the proposed models is verified experimentally in a wide range of powers dissipated in electronic devices operating in different configurations of the used cooling system.
Highlights
The problem that contemporary electronics still has to handle is effective cooling of electronic devices [1,2,3,4,5]
The solutions to reduce the value of the internal temperature of electronic devices are various cooling methods [5,16,17]
A way of modelling the thermal properties of an electronic device operating in the free convection and forced convection conditions is presented
Summary
The problem that contemporary electronics still has to handle is effective cooling of electronic devices [1,2,3,4,5]. It is becoming even more important with an increase in the integration scale of semiconductor dies, dissipated power, and power density [6,7,8,9]. As a result of self-heating, the internal temperature of semiconductor devices may reach values leading to a significant shortening of the device’s lifetime and to its immediate catastrophic failure [13,14,15]. Forced cooling methods mostly make use of fans, and, liquid cooling systems [30,31,32,33,34] and thermoelectric (Peltier) modules [35,36] are used
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