Influence of resin content on the surface covered with adhesive

Abstract

It is well known that the resin content within a particleboard influences the extent of the surface covered with adhesive and thus the properties of particleboards produced. The purpose of this research was to determine how the resin content and particle size class influence the surface of particle covered with the adhesive. For that purpose, wood particles used for particleboard production were used. Particles were blended with a UF adhesive with 0.05% of fluorescent dye added prior to blending and subsequently exposed to a resin curing temperature of 180 °C. The resin content was varied between 7.5 and 12.5%. The adhesive surface coverage was determined using a microscope with a fluorescent light source and a CCD camera. The results showed that the surface coverage increased with increasing resin content and increasing wood particle size.