Influence of residual stresses and grain size on the spinodal decomposition of metastable Ti1 − xAlxN coatings

Abstract

At elevated temperatures, the metastable Ti1−xAlxN solid solution decomposes in cubic AlN and cubic TiN. Within this work, the effect of residual stresses on the decomposition of sputtered Ti1−xAlxN coatings was investigated. Using different bias voltages, a series of Ti1−xAlxN coatings (x=0.63) with stresses ranging from +630 to −2500MPa was synthesized on Si (100) substrates. Vacuum annealing treatments and subsequent X-ray diffraction measurements showed that tensile stresses foster the formation of more volume consuming cubic TiN domains, while compressive stresses promote the formation of smaller cubic AlN domains. The influence of the grain size has been considered by investigations of free standing films using differential scanning calorimetry. Smaller grains lead to faster decomposition and earlier precipitation of wurtzite AlN.