Abstract

Mechanical properties of TiAlN thin films with different residual stress, which were fabricated with magnetic filtered vacuum arc evaporation deposition method on silicon substrate, have been investigated. The mechanical properties of TiAlN thin films vary with the residual stress existed in TiAlN thin film. For a lower residual stress, the nanoindentation hardness (H) and modulus (Er) of TiAlN thin film are 18.96 and 210.16GPa respectively. With the increasing of the residual stress, the H and Er of TiAlN thin film decline from 18.96 and 210.16 GPa to 16.9 and 185.9GPa respectively. High residual stress induces the decreasing of the H and Er of TiAlN thin film. The empirical expressions of H and Er versus the mean residual compressive stress (σ) have been obtained for the TiAlN thin films.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.