Influence of processing conditions on adhesion between carbon fibers and electron-beam-cured cationic matrices

Abstract

Adhesion between an electron-beam-cured Diglycidyl Ether of Bisphenol A (DGEBA) epoxy matrix and AS4 carbon fibers has been evaluated with the microindentation test method and compared with similar thermally cured materials. The results indicate that the absence of amine compounds and of high temperature treatment associated with thermally cured epoxy matrices are detrimental to fiber-matrix adhesion in electron-beam-cured epoxy matrices when measured by the microindentation test. Electron beam processing was not found responsible for any adsorption and/or deactivation of the irradiated carbon fiber surface as determined by surface analysis with X-ray Photoelectron Spectroscopy (XPS). Moreover, the relationship between electron-beam processing conditions (namely, dose and dose increment) with the resulting matrix properties and the adhesion to carbon fiber have revealed a strong dependency of fiber-matrix adhesion on the bulk matrix properties independent of the electron beam processing history. Undercured electron-beam-processed matrices exhibit higher adhesion to carbon fibers that can be explained by a higher matrix shear modulus.