Influence of process parameters on component assembly and drop test performance using a novel Anisotropic Conductive Adhesive for lead-free surface mount assembly

Abstract

The novel Anisotropic Conductive Adhesive (ACA) investigated in this research uses a magnetic field to align the conductive particles in the Z-axis direction, during cure, thereby eliminating the need for pressure and the requirement to capture a monolayer of conductive particles. The formation of conductive columns within the adhesive matrix, during cure, provides a very high insulation resistance between adjacent conductors and also eliminates the need for precise printing or dispensing of adhesives onto individual fine pitch pads. The novel ACA can also be mass cured, eliminating the need for sequential component assembly. The formation of columns also alleviates the problems associated with coplanarity errors and varying lead/bump shapes in forming reliable interconnections using traditional ACAs.