Influence of Powder Plasticity on Bonding Strength of Cold-Sprayed Copper Coating

Abstract

When cold spraying is performed at a velocity equivalent to or greater than a specific material-dependent critical velocity, powders suffer intensive plastic deformation and localized heating of interacting surfaces. The thermomechanical reaction of the sprayed powder upon impacting the substrate material triggers thermally dependent metallurgical bonding and/or mechanical interlocking mechanisms. In this study, three Cu feedstocks, fabricated through electrolysis (EP), gas-assisted water atomization (WA), and inert gas atomization (GA), were characterized and annealed before cold spraying. The electron back-scattered diffraction technique was used to analyze the grain structure and plastic microstrain within the powders and coatings. The plastic microstrains that originally existed in the Cu powders were released after 30 min of annealing at 500 °C. The influence of plastic deformation behavior (associated with the grain structure and plastic microstrain of powder feedstocks) on the bonding strength of the cold-sprayed Cu coatings on AA6061 aluminum alloy substrates was examined. The results indicate that EP powder with an asymmetric dendrite morphology was not conducive to the intensive plastic deformation that may cause recrystallized twin grains to form after cold spraying. Furthermore, the homogeneous microstructure of the spherical Cu feedstocks, which may be induced by strain release as recrystallized twin grains and low-angle boundary grain growth through annealing, caused the cold-sprayed Cu coating to have high ductility and low hardness. The findings reveal the low strain hardening and residual stress in the cold-sprayed coating—characteristics regarded as providing key advantages for the bonding strength of the coating.