Abstract
In typical industrial processing of tunnel oxide passivated contact (TOPCon) solar cells, poly‐Si is deposited on the entire back of the cells. During the deposition process, a wrap‐around of poly‐Si onto the edges and the front side of the cells is virtually unavoidable if chemical vapor deposition processes are used. Plasma‐enhanced chemical vapor deposition (PECVD) is used to investigate very thin poly‐Si films and their effect on wrap‐around on bifacial TOPCon solar cells fabricated without wrap‐around etching. As a result, reduction of the poly‐Si thickness down to 30 nm significantly increases the shunt resistance, reduces the reverse bias current, and thus reduces the risk of hot spots as measured by IR imaging and microcharacterization by secondary electron microscopy. Electroplated metallization proves to be a suitable candidate for contacting such thin TOPCon layers, being less sensitive than screen‐printed metallization.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
