Influence of phosphorous content on microstructure development at the Ni-P Plating/SAC interface

Abstract

Studies of the commonly used Ni-P surface finish of 4.3 and 11.6 wt. % of P content electroless plated on nickel substrates followed by their reaction with SAC305 solder were performed. It was demonstrated that the Ni-4.3P plating was crystalline, while the Ni-11.6P was mostly amorphous. The transformation of the Ni-P into Ni3P phase took place at 672 K and 605 K for low and high P amount, respectively. The activation energy (E a ) of the crystallization processes in the Ni-P plating was lower for the Ni-11.6P plating. Interaction of SAC305 solder with both types of the inspected plating showed the creation of (Cu,Ni)6Sn5 phase in the form of thin layer and large scallops, while for Ni-11.6P/SAC305 interface also (Ni,Cu)3Sn4 phase. The thickness of these phases was larger in the case of low phosphorous containing plating. The Ni-11.6P plating after the reaction with SAC305 totally transformed into Ni12P5, while the enrichment in P up to 10.5 wt. % occurred in the Ni-4.3P which did not lead to the appearance of any NixPy type phases. After the reaction of plating with solder the Ni2SnP phase was not identified. This was related to the absence of spalling phenomenon of the intermetallics into solder.