Abstract
Owing to the limitations of experimental characterization, a combination of numerical methods based on image-based microstructure reconstruction, microstructure simulation, and finite element analysis was utilized to investigate the influence of phase inhomogeneity on the electromigration behavior in microscale Cu/Sn-58Bi/Cu solder joints. The current crowding effect induced by phase inhomogeneity was revealed, and the maximum current density was two orders of magnitude greater than the minimum current density in a microstructure under current stressing. The current density carried by Sn-rich phases was much larger than that carried by Bi-rich phases, and the migration and diffusion behavior of Bi atoms in the Sn-rich phase were analyzed. Results showed that the Bi atomic flux caused by a Joule heat-induced temperature gradient was limited in this study.
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