Abstract
Electrodeposition of 0.5 mm thick 2.4T CoFe films with 60-63 wt% Fe was achieved at various solution pHs (2.0, 2.2, 2.3, 2.4, 2.6, and 2.8, respectively) in the presence of saccharin on 6 in AlTiC wafers with Cu-seed layer. The effect of pH on electrodeposition including voltammetric behavior, plating rate, and selectivity ratio was discussed. The increase of solution pH affects some material properties like: surface roughness, grain size, morphology, and corrosion. Notably, texture, coercivity, and tensile stress of 0.5 mm 2.4T CoFe films with 60-63 wt. % Fe are less affected by solution pH. Possible reasons for such behavior were discussed.
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