Abstract
In this study, highly conductive nickel/copper sulfide‐polyacrylonitrile (Ni/CuS‐PAN) fibers were prepared by electroless nickel plating on CuS‐PAN fibers. The electromagnetic interference (EMI) shielding properties of the Ni/CuS‐PAN fibers were investigated as a function of nickel‐plating time. X‐ray photoelectron spectroscopy and X‐ray diffraction analyses were performed to examine the surface properties of the prepared Ni/CuS‐PAN. The surface morphology of the Ni/CuS‐PAN fibers was observed using scanning electron microscopy. The volume resistivity of the samples was measured using a four‐point probe electrical resistivity tester, and the EMI shielding effectiveness (EMI‐SE) was tested using an EMI shielding analyzer. The EMI‐SE of the Ni/CuS‐PAN fibers was significantly improved compared with those of the as‐received CuS‐PAN fibers. In addition, the EMI‐SE generally increased as the nickel‐plating time increased, with the highest EMI‐SE of the 50‐Ni/CuS‐PAN being approximately 45 dB at 2.05 GHz. The nickel layer was a key factor in determining the EMI‐SE of the Ni/CuS‐PAN fibers.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
