Influence of microstructure and heat treatment on thermal conductivity of rheocast and liquid die cast Al-6Si-2Cu-Zn alloy

Abstract

Thermal conductivity of a rheocast component made from Stenal Rheo1 (Al-6Si-2Cu-Zn) alloy was investigated in as-cast, T5 and T6 conditions. The thermal conductivity measurement in different locations showed variation of this property throughout the rheocast component. The results of microstructural investigation revealed that the ratio of solute-lean α1-Al particles formed during slurry preparation to fine solute-rich α2-Al particles formed during secondary solidification had significant influence on thermal conductivity. The reduced amount of solutes in the α1-Al particles was determined as the root cause of higher thermal conductivity. A linear relation between the fraction of precipitates and the increase in thermal conductivity was obtained and silicon in solid solution is shown to have a dominant influence. As silicon was precipitated during the heat treatment, thermal conductivity increased. For an optimal combination of thermal and mechanical properties, it is therefore important to use an ageing temperature above the temperature of Si precipitation.