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Abstract
Three configurations of a magnetron sputter ion plating system were considered: the double magnetron open field configuration, single magnetron multipole open field configuration and single magnetron multipole closed field configuration. The (Ti,Al)N coating was deposited in the double magnetron system onto substrates oscillating in and out of high ionization degree plasma obtained by overlapping two magnetron discharges. A strong influence of plasma “density” on the coating growth was found. The experiments were also performed in two single magnetron systems in order to find approximately the region in which a plasma suitable for coating deposition is generated. A rough estimation of high density plasma pattern was given based on voltage-current characteristics of the magnetron discharge. Both single magnetron systems were found suitable for hard coating deposition, but the higher bias current density at the substrate surface had been measured in closed field configuration under similar deposition conditions.
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