Abstract
Internal reflection infrared spectroscopy was used to examine the effect of potassium ions on the interaction of water with silicon dioxide at low temperature, relevant to chemical mechanical planarization (CMP) of silicon dioxide. Silanol (SiOH) formation was enhanced in silicon dioxide samples exposed to aqueous solutions of potassium chloride and potassium nitrate as compared to those exposed to water, due to a reduction in the thermodynamic activity of the water in potassium salt solutions. However, molecular water was the predominant hydrous species observed in the silicon dioxide. The presence of potassium ions had no significant effect on the effective diffusion coefficient of water in silicon dioxide. Results presented here indicate that the potassium ion concentration, and more specifically the water activity, is a critical factor in the chemical component of the silicon dioxide CMP mechanism. © 2004 The Electrochemical Society. All rights reserved.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
