Abstract

The results of studying the effect of hot carrier degradation on the electrical characteristics of high-power laterally diffused metal oxide semiconductor (LDMOS) transistors made according to the silicon-on-insulator (SOI) technology, with a long drift region with topological norms of 0.5 microns, are discussed. The analysis of the degradation of hot carriers in high electric fields is based on the experimental results and the additional use of an analytical model. The physical origin of this mechanism is related to the formation of traps at the Si/SiO2 interface. With the help of numerical analysis and experiments, the electrical character-istics of SOI nLDMOS transistors are considered in a wide range of control voltages in order to study their effect on the safe operation zone and reliability of the device under conditions of the degradation of hot carriers. The results of these studies allow us to conclude that a 20% expansion of the safe operation zone is possible.

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