Abstract
Additions of 0.1 at.% Be, 0.1 at.% Ag, and 0.03, 0.1, 0.3, and 1.0 at.% Au in copper are observed to suppress recovery of electrical resistivity below 60 deg K following electron irradiation. The effects of Ag and Au are essentially the same; Be is considerably more effective in suppressing recovery. The effects of composition of Au are evaluated. It appears that close-pair recombination is accomplished with only one or two jumps, on the average, and that other recovery processes involve appreciably more jumps. The number of potential trapping sites associated with each Au atom appears to be over 30 and may approach 100. (auth)
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