Abstract
In this research, the influences of filler content and filler particle size on the flow-hardening behavior were investigated by a measuring mixer. In order to more reliably assess the observed rheological behavior, isothermal differential scanning calorimetry (DSC) measurements were employed to study the curing kinetics of the compounds. The measured data can be fitted well with Kamal-Sourour’s model modified by the diffusion correlation according to Chern and Poehlein. After that, the influence of filler content and size on the kinetic parameters are presented discussed. The results show that the ultimate glass transition temperature is significantly lower for pure epoxy resin (EP) than for compounds filled with surface-treated glass beads, which have an essential effect on the diffusion-controlled reaction at different curing temperatures. For the surface-treated glass beads used in this study, the reaction speed in the early curing stage is accelerated by increasing filler content or decreasing of filler size. In the later curing stage, the reaction speeds of compounds with higher filler content or smaller fillers reduce more quickly. The study of reaction kinetics indicates that the activation energy Ea1, Ea2, the reaction order m, and n are affected differently by varying filler content and size.
Highlights
As the electrification of automobiles steadily advances, the cars today contain more and more electrical and electronic elements in the controlling system and in the propulsion system. To ensure they protected from mechanical damage, contaminants, and moisture, electronics are often encapsulated in epoxy molding compounds (EMC) by using injection molding or transfer molding as manufacturing techniques for mass production [1]
In Epoxy resins, a three-dimensional network structure is present after curing, which leads to great mechanical and heat-/moisture-resistance properties, which are perfectly suitable to protect the devices from the environment
To understand the rheological results, the reaction kinetics were studied with isothermal differential scanning calorimetry (DSC) measurements
Summary
As the electrification of automobiles steadily advances, the cars today contain more and more electrical and electronic elements in the controlling system and in the propulsion system To ensure they protected from mechanical damage, contaminants, and moisture, electronics are often encapsulated in epoxy molding compounds (EMC) by using injection molding or transfer molding as manufacturing techniques for mass production [1]. In Epoxy resins, a three-dimensional network structure is present after curing, which leads to great mechanical and heat-/moisture-resistance properties, which are perfectly suitable to protect the devices from the environment Similar to thermoplastics, these EMCs contain different kinds of fillers to improve their mechanical, thermal or electrical properties, to tailor their property profile to the applications. They are widely used as a reinforcement for the plastic industry
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