Abstract
There is a striking dependence of the evaporation deposition geometry (i.e. angular distribution of the incident vapor beam) on the properties of deposited conductive films. This paper discusses solderability, adhesion and long‐term stability of adhesion of Ti‐Pd‐Au, Ti‐Au and Ti‐Cu films. In all cases the above properties were improved by an evaporation deposition geometry with steep angles of the incident vapor beam.
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