Abstract
In this paper, 0.1 wt% Ti particles (2–5 μm) was incorporated into the Sn58Bi solder to improve the properties of Sn58Bi/Cu solder joint. The interface reaction and growth kinetics of the Sn–Cu IMC at the solder/Cu interface during solid–liquid diffusion at temperature of 180, 190 and 200 °C for three different time (10, 20 and 30 min) was systematically investigated. The solder/Cu interface presented a duplex structure of Cu6Sn5 and Cu3Sn IMC. The IMC thickness was developed with the higher soldering temperature and prolonged soldering duration. The diffusion coefficient (D) of different IMC layer increased with the increasing of soldering temperature. The activation energies (Q) of the overall IMC layer were calculated as 48.22 kJ/mol for Sn58Bi solder joint and 58.20 kJ/mol for Sn58Bi–0.1Ti solder joint. Especially, adding the 0.1 wt% Ti particles can inhibit the interfacial IMC growth during solid–liquid diffusion, which may be conducive to the improvement of the solder joint reliability.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Materials Science: Materials in Electronics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
