Abstract
A series of phenylethynyl-terminated imide oligomers based on 3,4′-oxydianiline (3,4’-ODA), with different content of 2,3,3′,4′-oxydiphthalic dianhydride (a-ODPA) and 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA), have been prepared by chemical imidization process. The effects of different dianhydrides ratios on curing behavior, solubility, melt viscosity of oligomers, glass transition temperature (Tg), coefficient of thermal expansion (CTE), thermal stability, mechanical performance of films, and adhesive properties were evaluated systematically. The prepared oligomers with more content of a-ODPA exhibited sufficient solubility in some solvents, lower melt viscosity and better adhesion. The cured resins with more content of a-BPDA exhibited lower CTE value, higher Tg and thermal stability in N2 and air atmosphere. The Tg value of the cured a-BPDA/3,4’-ODA/PEPA system (Oligo-5) was 338 °C by tan δ. Meanwhile, the obtained polyimide films based on a-ODPA/a-BPDA monomers possessed high tensile strength (> 98.0 MPa) and strain (> 10.3%). These detailed results may provide some help to choice suitable matrix resin for structural adhesive and high-performance resin-based composite materials.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
