Abstract
The Si3N4 thin film is prepared by MWECR-PECVD at different deposition temperature and the structure of the Si3N4 thin film is investigated. The results indicate that the structure of the Si3N4 thin film prepared at low deposition temperature is in the amorphous phase. However, when the deposition temperature increases to 280°C, the Si3N4 thin film changes to crystalline α-Si3N4. With a further increase of the deposition temperature, the grain of the Si3N4 thin film becomes more fine, uniform and flat. XRD analysis shows that the structure of the Si3N4 thin film prepared at 280°C is of a crystalline structure.
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