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Abstract
Ultrafine grained Cu–Nb alloys with minimal additions of 1wt.% Nb were prepared by using HPT at ambient temperature (˜20°C) and elevated temperature (˜200°C). The microstructure, thermal stability and properties were investigated. The results indicated that compared with the Cu-1%Nb alloy processed at ambient temperature, the sample processed at 200°C shows higher density and higher thermal stability, which contributed to its higher electrical conductivity and tensile strength after annealing treatment.
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