Abstract
Metal 3D printing based on the photopolymerization reaction (Digital Light Processing—DLP) of an organic matrix in which metal particles are embedded is a developing technology. This technology requires a step of resin removal and densification by sintering to obtain a metal part. This process has been applied to copper. Photocurable formulations with a high loading rate of copper powder of 60 vol.% were developed and suitable for DLP printing with thicknesses > 25 µm. Debinding and sintering cycles were investigated on specimens fast cured by gamma irradiation to save materials and time. A debinding in air at 400 °C and sintering in hydrogen lead to a C content of 0.018 wt.%, similar to the raw copper powder and slightly higher oxygen content. The low thermal conductivity of 250 W·m−1·K−1 highlighted the harmful effect of phosphorus from the powder and photoinitiators such as BAPO. The C and O contents and the thermal conductivity measured on copper parts printed by DLP confirm the results obtained on specimens cured by gamma irradiation.
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