Influence of Cure Conditions on the Adhesion of Rubber Compound to Brass-plated Steel Cord. Part I. Cure Temperature

Abstract

The effect of the cure temperature of rubber compound on the adhesion with brass-plated steel cord was investigated in conjunction with the formation, growth and degradation of the adhesion interphase formed between the rubber compound and brass-plated steel cord. With increasing cure temperature from 130°C to 190°C, the pull-out force after cure decreased linearly. This decrease in adhesion force at higher temperature may be explained by the limitation of the mass transfer of vulcanizing agents into the adhesion interphase and/or rubber compound near the adhesion interphase, resulting in a deficiency of sulfur due to the fast cure of the rubber compound which significantly retards the diffusion of vulcanizing chemicals. Also, at a high temperature, an adhesion interphase with a ZnS-rich layer, which may act as a barrier to copper diffusion for the formation of the adhesion interphase of copper sulfide, was formed. After thermal aging of the adhesion samples, the pull-out force decreased in comparison with that of the unaged. The decrease of pull-out force after thermal aging stemmed mainly from the decline of the tensile properties after thermal aging. The adhesion property after humidity aging was completely different from that after thermal aging. With increase in the cure temperature to 160°C, the pull-out force increased. But further increase in the cure temperature caused a decline in pull-out force. This phenomenon can be explained by the degradation of the adhesion interphase. At lower cure temperatures, a severe growth of copper sulfide and a large extent of dezincification were observed in the adhesion interphase. At higher cure temperatures, a significant growth of copper sulfide in the adhesion interphase appeared. The proper formation of the adhesion interphase and good physical properties of the rubber compound at a moderate cure temperature can result in high retention of adhesion properties.