Abstract
With nanoparticles (NPs) for enhancement the reliability of solder joints and interconnections is a trending research arena. In this study, Cu NPs prepared by chemical reduction method, were doped into flux and disseminated to the pure Sn solder (initial diameter of 1.4 mm) and iterfaces during reflow at 250 °C for 30 s and 90 s. For the experiment, the solder corresponding to flux without NPs content was observed to have the bigger thickness of Cu 6 Sn 5 layer, compare with the specimen treated with flux with nanoparticles. The presence of Cu NPs was observed to hinder the IMC growth. Upon cooling, the oxides formed by Cu NPs altered the screw-dislocation driven growth of prismatic IMCs and thus produced Cu 6 Sn 5 rods with tapered ends. In the sector of microelectronic packaging materials design, the technique of doping the flux with Cu nanoparticles can be utilized to optimally tailor the interfacial IMC layer microstructure and the thickness.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
