Abstract
Influence of Cr alloying on the oxidation behavior of Sn–8Zn–3Bi–xCr (SZBxCr) (x = 0, 0.1, 0.3, 0.5) solders under 250 °C has been investigated. It was found that the poor oxidation resistance of the solders is attributed to the oxidation of Zn–rich phase and other Zn atoms which diffused to the β-Sn matrix grain boundaries which form ZnO. With Cr addition, two types of Sn–Zn–Cr phases, along the grain boundaries of β-Sn matrix and across the Zn-rich phase, were detected in Cr-bearing solder alloys, which prevent the oxygen from diffusing into the bulk of the solder, and the SZB0.3Cr alloy had the best oxidation resistance.
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