Abstract

The dependence of the rate of Ni dissolution from PtNi alloys on the chloride concentration was studied electrochemically in 0.5 M HClO 4 at room temperature. Electrodeposited PtNi catalysts were subjected to extensive potential cycling between 20 mV and 1.3 V at various Cl − concentrations and the cyclic voltammograms (CV) response and the oxygen reduction reaction (ORR) activity of the catalysts were determined at different intervals. Energy dispersive X-ray spectroscopy (EDS) and inductively coupled plasma spectroscopy (ICP) analyses were carried out to determine the elemental composition of the alloys and the amount of dissolved Ni at different stages of the potential cycling. It was found that the presence of Cl − increases the rate of Ni dissolution and by this accelerates the dealloying process relative to potential cycling in chlorine-free solutions. Dealloying is most pronounced during the initial stages of potential cycling. Already a small amount of Cl − is sufficient to dissolve the majority of the non-noble metal from the alloys. Even then, under oxygen reduction conditions, the blockage of Pt surface by Cl − is less pronounced for the alloys than for pure Pt catalysts, leading to marginally improved ORR activity for the PtNi alloys at low Cl − concentrations. From a practical point of view, the effect of chloride ion leakage from a commercially available saturated KCl reference electrode on the electrocatalytic activity was also investigated.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.