Abstract
Al/Ni multilayer film shows self-propagating exothermic reaction. By applying a small energy into the film, a NiAl intermetallic compound is formed, and simultaneously the heat generates. We use an Al/Ni exothermic film as a heat source for locally and instantly soldering Si wafers. However, cracking in the reacted NiAl layer is a big problem to be overcome in this reactive bonding technique. In this paper, we try to optimize the bonding condition without generating cracks.
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