Abstract
Three-dimensional (3D) integration sets improved requirements on the structure and performance of the Ni deposits. Pulse reverse current (PRC) electroplating is regarded as a promising technique to obtain Ni plating fulfilling such requirements. This work investigated the influence of two PRC parameters, average current density and pulse frequency, on surface morphology and grain size of the Ni deposits. Ni deposits were prepared by first direct current (DC) pre-plating and then PRC electroplating process of given average current density and pulse frequency. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) were employed to characterize the deposits. It was found that the surface morphology and grain size of the Ni deposits were significantly influenced by average current density and pulse frequency. Such results are instructive in the electroplating obtainment of Ni for packaging applications.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
