Abstract

First-principles calculations was used to explore the influence of atom termination and stacking sequence on the interface strength and stability between θ′(Al2Cu) precipitate and Al matrix along experimentally observed orientations, (001)θ′/(001)Al and (010)θ′/(010)Al interfaces. Six interfacial structures were modeled, and work of adhesion, bonding characters, number of valence electrons and thermal stability had been studied. Calculated results revealed that the Cu-terminated interface has larger work of adhesion than Al-terminated interface, and hollow site stacking sequence, with stronger bonding, is superior to top site stacking sequence, adhesion strength for coherent (001)θ′/(001)Al interface is better than that for semi-coherent (010)θ′/(010)Al interface. These differences are attributed to the bonding feature and number of valence electrons. Among the six interface models, the Cu-terminated (001)θ′/(001)Al interface with hollow site stacking has the largest work of adhesion and the smallest interface energy, indicating that it has the best mechanical and thermodynamic properties.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.