Abstract
The adhesion of sputtered TiC films to steel substrates has been found to increase as the Ar deposition pressure is decreased. The films were deposited by rf sputtering with a large initial dc bias on the substrates. The pressures investigated were 35, 25, and 15 mTorr and the films ranged in thickness from 0.3 to 3.2 μm. A modified scratch test was used to measure adhesion. The increase in film adhesion is suggested to result from increased mixing within the film/substrate interfacial region. Auger spectroscopy was used to obtain elemental concentration vs sample depth profiles through the interface.
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