Influence of agglomerated diamond abrasive wear on sapphire material removal behavior

Abstract

Further to explore the effect of the agglomerated diamond (AD) abrasive wear on material removal behavior of sapphire in lapping, the pin-on-disk test with an AD abrasive was carried out. The classifications of AD abrasive wear, material removal behavior of sapphire, friction coefficient of sliding contact and removal ratio of sapphire material were thoroughly investigated. The wear behavior of the AD abrasive shows two types: attrition wear and micro-fracture. Three wear statuses of the active cutting diamond grains fixed on the AD abrasive surface, including attrition wear, worn-flat and pull-out, occur in the tests. The sapphire material is mainly removed by the AD abrasive via plastic deformation. The micro-fracture feature of the AD abrasive improves its self-sharpening ability. Therefore, the micro-cutting action of the AD abrasive on the sapphire wafer has behaved well.