Abstract
In this study, the influence of additives (Cl−, thiourea and gelatine) and pulse plating parameters on the structure and properties of copper coatings obtained through an acid copper plating bath was studied. In order to determine the properties of deposited layers, a microhardness tester was used for microhardness measurement, X-ray diffraction for microstructural analysis, and a scanning electron microscope equipped with an electron backscatter diffraction module for determining morphology and obtaining crystallographic information. In addition, transmission electron microscopy was used to study the presence of twin boundaries in the copper coatings. The experiment results showed that pulse plating and addition agents mutually interfere with each other, causing changes in the microstructure that lead to changes in the mechanical properties of the copper deposits. By the appropriate combination of additives with pulse plating parameters it was possible to synergistically improve the quality and mechanical properties of the deposits.
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